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SIEMENS SEMI CC2510CC2511DK 2.4 GHZ RADIO TRANSCEIVER DEV. KIT, KIT APPLICATION TYPE:WIRELESS CONNECTIVITY, APPLICATION SUB TYPE:2.4GHZ WIRELESS COMMUNICATION
SIEMENS SEMI DKLM3S9D96 STELLARISLM3S9D96 DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:LM3S, KIT APPLICATION TYPE:COMMUNICATION
SIEMENS SEMI CC2430DK CC2430 DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC2430, KIT APPLICATION TYPE:COMMUNICATION APPLICATI
SIEMENS SEMI CC2430ZDK CC2430 ZIGBEE DEVELOPMENT KIT , SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC2430, KIT APPLICATION TYPE:COMMUNICATION A
SIEMENS SEMI CC2530ZDK CC2530 ZIGBEE DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC2530, KIT APPLICATION TYPE:COMMUNICATION AP
SIEMENS SEMI DKLM3S9B96 STELLARIS LM3S9B96 MICROCONTROLLER DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:LM3S9B96, KIT CONTENTS:BOARD, CABLES,
SIEMENS SEMI ADS5400EVM ADS5400 ADC EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:ADS5400, KIT APPLICATION TYPE:DATA CONVERTER, APPLICATION S
SIEMENS SEMI ADS5400IPZP IC, ADC, 12BIT, 1000MSPS, HTQFP-100, RESOLUTION (BITS) :12BIT, SAMPLING RATE:1GSPS, INPUT CHANNEL TYPE:DIFFERENTIAL, DATA INTERFACE:SERIAL, SUPPLY VOL
SIEMENS SEMI ADS8568EVMPDK 16BIT ADC EVAL. MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:ADS8568, KIT APPLICATION TYPE:DATA CONVERTER, APPLICATION SUB TYPE
SIEMENS SEMI CC1101DK433 CC1101 DEVELOPMENT KIT 433MHZ, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC1101, KIT APPLICATION TYPE:WIRELESS CONNECTIVITY, APPLICA
SIEMENS SEMI CC1110CC1111DK CC1110 AND CC1111 DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC1110, KIT APPLICATION TYPE:WIRELESS CONNECTIVITY, APP
SIEMENS SEMI CC2400DK CC2400DK DEVELOPMENT KIT , SUPPORTED FAMILIES:RFIC, DEVELOPMENT TOOL TYPE:HARDWARE / SOFTWARE - DEV KIT (DEV TOOL), SUPPORTED DEVICES:CC2400 , TOOL/BO
SIEMENS SEMI CC2420DBK CC2420DBK DEMONSTRATION BOARD KIT , SUPPORTED FAMILIES:RFIC, DEVELOPMENT TOOL TYPE:HARDWARE / SOFTWARE - EVAL/DEMO BOARD, SUPPORTED DEVICES:CC2420, TO
SIEMENS SEMI CC2420DK CC2420DK DEVELOPMENT KIT , SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC2420, KIT APPLICATION TYPE:WIRELESS CONNECTIVITY, APPLICATION
SIEMENS SEMI CC2431DK CC2431 DEVELOPMENT KIT , DEVELOPMENT TOOL TYPE:HARDWARE / SOFTWARE - DEV KIT (DEV TOOL), SUPPORTED FAMILIES:RFIC, FEATURES:EVALUATE THE SMARTRF04 PROD
SIEMENS SEMI CC2431ZDK CC2431 ZIGBEE DEVELOPMENT KIT , DEVELOPMENT TOOL TYPE:HARDWARE / SOFTWARE - DEV KIT (DEV TOOL), SUPPORTED FAMILIES:RFIC, TOOL/BOARD APPLICATION:WIRELE
SIEMENS SEMI CC2520DK CC2520 DEVELOPMENT KIT , SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:CC2520, KIT APPLICATION TYPE:WIRELESS CONNECTIVITY, APPLICATION S
SIEMENS SEMI DLPLIGHTCRAFTER DLP LIGHTCRAFT EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:TMS320DM365, KIT APPLICATION TYPE:DISPLAY, CORE ARCHITEC
SIEMENS SEMI DAC3484EVM DAC3482 16-BIT DAC EVAL. MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, KIT APPLICATION TYPE:DATA CONVERTER, APPLICATION SUB TYPE:DAC , ROHS COMPLIANT
SIEMENS SEMI TMDSDCDCLEDKIT PICCOLO BASED DC/DC LED SEPIC DEVELOPER\'S KIT, INPUT VOLTAGE:12V TO 36V
SIEMENS SEMI RIANTG04E30 SERIES 2000 RFID GATE ANTENNA MEDIUM W/ 1M CABLE, CONNECTOR TYPE:SPADE/TUGUE, FREQUENCY:134.2KHZ
SIEMENS SEMI TSBKS800OHCI TSB81BA3PFP SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:TSB81BA3D, KIT APPLICATION TYPE:COMMUNIC
SIEMENS SEMI TRF2443EVM TRF2443 EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:TRF2443, KIT APPLICATION TYPE:COMMUNICATION APPL
SIEMENS SEMI TRF3765EVMF INTEGER-N/FRACTIONAL-N PLL EVAL. MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:TRF3765, KIT APPLICATION TYPE:CLOCK APP
SIEMENS SEMI TMDSEVM642 DM642 EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:DM642, KIT APPLICATION TYPE:AUDIO / VIDEO / TV, APPLICATION SUB
SIEMENS SEMI TMDXEVM365 DM365 DIGITAL VIDEO EVALUATION MODULE (DVEVM), SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:DM365, KIT APPLICATION TYPE:AUDIO / VIDEO
SIEMENS SEMI TMDSACDCKIT C2000 AC/DC DEVELOPERS KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:C2000, KIT APPLICATION TYPE:POWER MANAGEMENT - VOLTAGE REGULA
SIEMENS SEMI TMDSCCS20001 CODE COMPOSER STUDIO IDE V3.3 FOR C2000, CORE ARCHITECTURE:C2000, SUPPORTED FAMILIES:MSP430(TM), STELLARIS(R) AND CORTEX(TM) -R4, NO. OF USER LICENSE
SIEMENS SEMI TMDSCCSALL1 CODE COMPOSER STUDIO IDE V3.3 FOR ALL TI EMBEDDED PROCESSORS, CORE ARCHITECTURE:ARM, C5000, C6000, SUPPORTED FAMILIES:TMS320C2800, MSP430(TM), STELLA
SIEMENS SEMI TMDSDMK642 DM64X DIGITAL MEDIA DEVELOPER\'S KIT W/ NTSC CAMERA, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:DM64X, SILICON FAMILY NAME:EXPRESSDSP
SIEMENS SEMI TMDSEVM357 DM357 DIGITAL VIDEO EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:ARM, CORE SUB-ARCHITECTURE:ARM9, SILICON CORE NUMBER
SIEMENS SEMI TMDSEMUPP MICROPROCESSOR DEVELOPMENT TOOL, CORE ARCHITECTURE:ARM, IC PRODUCT TYPE:EMULATOR, FEATURES:USB BUS POWERED, NO POWER SUPPLY, SUPPORTS USB 1.X AND USB
SIEMENS SEMI TMDSEVM6424 C6424 DSP EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:C6000, CORE SUB-ARCHITECTURE:ARM9 / DSP, SILICON CORE NUMBER:O
SIEMENS SEMI TMDSEVM3530 OMAP35X EVALUATION MODULE (EVM), SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:ARM, CORE SUB-ARCHITECTURE:CORTEX - A8, SILICON CORE NUMBE
SIEMENS SEMI TMDSVDP6437 DM6437 DIGITAL VIDEO DEVELOPMENT PLATFORM, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:C6000, CORE SUB-ARCHITECTURE:ARM9 / DSP, SILICON
SIEMENS SEMI TMDXMDKEK1258 AFE FOR C5505 ECG MEDICAL DEVELOPMENT KIT, SILICON MANUFACTURER:TEXAS INSTRUMENTS, SILICON CORE NUMBER:ADS1258, INA 128, PCA9535, KIT CONTENTS:ELECTR
SIEMENS SEMI TMDXEVM1707 AM17X EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:ARM, CORE SUB-ARCHITECTURE:ARM9, SILICON CORE NUMBER:AM1X, SILICON
SIEMENS SEMI TMDXEVM6457 TMS320C6457 EVALUATION MODULE, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:C6000, CORE SUB-ARCHITECTURE:ARM9 / DSP, SILICON CORE NUMBER
SIEMENS SEMI TMDXEVM6455 C6455 DSP MULTIPROCESSOR DEVELOPMENT SYSTEM, SILICON MANUFACTURER:TEXAS INSTRUMENTS, CORE ARCHITECTURE:C6000, CORE SUB-ARCHITECTURE:ARM9 / DSP, SILIC